Electrodepositable dielectric coating compositions and methods related thereto

An electrodepositable coating composition comprising a resinous phase dispersed in an aqueous medium, said resinous phase comprising:

• (a) 5 to 90 weight percent of an ungelled, active hydrogen-containing, cationic amine salt group-containing resin;
• and
• (b) 1 to 80 weight percent of a blocked polyisocyanate curing agent,
• said resinous phase having a covalently bonded halogen content ranging from 1 to 50 percent by weight based on total weight of resin solids present in said resinous phase, wherein, when electrodeposited and cured to form a cured film, said cured film passes flame resistance testing in accordance with IPC-TM-650, and has a dielectric constant of less than or equal to 3.30.

A method for forming a dielectric coating on an electroconductive substrate serving as an electrode in an electrical circuit comprising the electrode and a counter-electrode, the electrode being immersed in an aqueous electrodepositable composition,

• said method comprising passing an electric current between the electrode and the counter-electrode to cause the electrodepositable composition to deposit on the substrate as a substantially continuous film, and
• heating the electrodeposited film to a temperature and for a time sufficient to cure the film, thereby forming a cured film,
• wherein the electrodepositable composition comprises a resinous phase dispersed in an aqueous media, said resinous phase comprising:
• (a) an ungelled, active hydrogen-containing, ionic group-containing electrodepositable resin;
• and
• (b) a curing agent reactive with the active hydrogens of the resin (a),
• said resinous phase having a covalently bonded halogen content of at least 1 percent by weight based on total weight of resin solids present in said resinous phase, and
• wherein said cured film passes flame resistance testing in accordance with IPC-TM-650, and has a dielectric constant of less than or equal to 3.50.