Crosslinkable polymer material of low relative permittivity, and films, substrates and electronic units formed of it
AssigneesTDK Corporation, Dai-Ichi Kogyo Seiyaku Co., Ltd.
InventorsShigeru Asami, Toshiaki Yamada, Teruaki Sugahara, Hiroshi Hotta
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Abstract
Disclosed is a polymer material of low relative permittivity obtained through copolymerization of a monomer composition that contains, as monomers, a fumaric diester and an epoxy group-having (meth)acrylate. The polymer material bonds or adheres well to metal conductor layers, and, after crosslinked, it is patternable. In addition, it has good electric properties of low relative permittivity, low dielectric loss tangent and good electric insulation, and has good heat resistance.
Claims7
A polymer material obtained through compolymerization of a monomer composition that contains, as monomers, a fumaric diester and an epoxy group—having (meth)acrylate represented by following formula (II):
- wherein R3 represents an alkylene group having from 1 to 4 carbon atoms;
- R4 represents H or CH3;
- A represents an alkylene oxide having from 2 to 4 carbon atoms;
- n indicates an integer of from 0 to 2;
- and X represents
Dependencies are inferred from the claim text.