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US 6,713,440 B2Granted
Resist and etching by-product removing composition and resist removing method using the same
AssigneeSamsung Electronics Co., Ltd.
InventorsDong-jin Park, Kyung-dae Kim, Sang-mun Chon, Jin-ho Hwang, Il-hyun Sohn, Sang-oh Park, Pil-kwon Jun
Life of this patent
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Abstract
A resist removing composition having a superior capability for removing a resist, polymer, organometallic polymer and etching by-products such as metal oxide, which does not attack underlying layers exposed to the composition and which does not leave residues after a rinsing step. The resist removing composition contains alkoxy N-hydroxyalkyl alkanamide and a swelling agent.
Claims21
A resist removing composition comprising:
- alkoxy N-hydroxyalkyl alkanamide;
- and
- a swelling agent, wherein the swelling agent is a hydroxylamine salt.
Dependencies are inferred from the claim text.