Carbon-conductive ink resistor printed circuit board and its fabrication method
AssigneeUni-Circuit Inc.
InventorHsi-Song Kao
Life of this patent
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Abstract
A embedded resistor printed circuit board fabrication includes the steps of preparing a substrate having a top conductive layer and a bottom insulating layer and etching the top conductive layer to form a first conductive layer having recesses in it; embedding resistive material in the recesses, enabling the first conductive layer to be electrically connected to lateral sides of the resistive material; plating a thin conductive film on the first conductive layer and the resistive material to form a second conductive layer; and etching the first conductive layer and second conductive layer to let the second conductive layer be electrically connected to the thin film type resistors.
Claims12
An embedded resistor printed circuit board fabrication method for forming circuit substrates having circuitry traces and embedded resistors, the method comprising the steps of:
- a. preparing a substrate having a top conductive layer and a bottom insulating layer, and then etching said top conductive layer to form a number of recesses in said top conductive layer;
- b. embedding thin film resistive material in said recesses and enabling said first conductive layer to be electrically connected to lateral sides of said thin film resistive material;
- c. plating a further conductive layer on top of said first conductive layer and said thin film resistive material to form a second conductive layer;
- and
- d. etching said second conductive layer to let said second conductive layer be electrically connected to said thin film type resistors.
A embedded resistor printed circuit board comprising:
- an insulation layer;
- a first conductive layer laid over the top side of said insulation layer and defining a number of recesses;
- resistive material embedded in said recesses and electrically connected to said first conductive layer;
- and
- a conductive layer laid over the top side of said first conductive layer opposite to said insulation layer, such that said first conductive layer, said resistive material and said second conductive layer are integrated into an electrical circuit, said second conductive layer having a pattern of layout the same as said first conductive layer.
Dependencies are inferred from the claim text.