Method of manufacturing a contract element and a multi-layered wiring substrate, and wafer batch contact board

A method for manufacturing a contact element for a wafer batch contact board, said wafer batch contact board comprising:

• the contact element, a multi-layered wiring substrate, and an anisotropic electrically conductive rubber between the contact element and the multi-layered wiring substrate to electrically connect the multi-layered wiring substrate with the contact element;
• said method comprising the steps of:
• (1)(a) forming a laminated body including an insulating film and at least one electrically conductive layer;
• (1)(b) forming, at predetermined positions of the insulating film, bump holes that extend from the surface of the insulting film to the at least one electrically conductive layer;
• (1)(c) spreading the laminated body on a support frame;
• (1)(d)performing surface treatment by carrying out a plasma treatment to treat the interior of the bump holes and/or the surface of the insulating film;
• and
• (1)(e) forming bumps on the bump holes treated in the surface treatment step;
• and the multi-layered wiring substrate being manufactured by the steps of:
• (2)(a) forming a first electrically conductive layer on an insulating substrate and patterning the first electrically conductive layer into a first wiring pattern;
• (2)(b) forming an insulating layer on the first wiring pattern and forming contact holes in the insulating layer;
• (2)(c) performing a surface treatment by carrying out plasma treatment on the interior of the contact holes and/or the surface of the insulating layer;
• (2)(d) forming a second electrically conductive layer on an insulating substrate and patterning the second electrically conductive layer into a second wiring pattern;
• and
• (2)(e) repeating the above-mentioned steps (b), (c), and (d) at least once.