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US 6,713,366 B2Granted
Method of thinning a wafer utilizing a laminated reinforcing layer over the device side
AssigneeIntel Corporation
InventorsWeng Khoon Mong, Yew Wee Cheong, Eng Chiang Gan, Mun Leong Loke
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Abstract
A method that includes, obtaining a substrate, placing a reinforcing layer over a first side of the substrate; and thinning the substrate by removing material from an opposite side of the substrate.
Claims27
A method, comprising:
- obtaining a substrate;
- placing a protective coating over a first side of the substrate;
- placing a reinforcing layer over the protective coating;
- thinning the substrate by removing material from an opposite side of the substrate;
- removing the reinforcing layer and the protective coating after thinning the substrate;
- and
- dicing the substrate after removing the reinforcing layer.
4 more elements
The method of 12, wherein the epoxy is UV cured.
A method comprising:
- placing a protective coating onto a device side of a wafer;
- placing a reinforcing layer over the protective coating;
- removing material from a non-device side of the wafer;
- removing the reinforcing layer,
- removing the protective coating;
- rinsing the wafer;
- mounting the wafer onto dicing tape;
- and
- dicing the wafer into individual dies after removing the reinforcing layer.
6 more elements
Dependencies are inferred from the claim text.