Lead frame for semiconductor package
AssigneeAmkor Technology, Inc.
InventorHyung Ju Lee
Life of this patent
Estimating the term…
Abstract
A semiconductor package including a lead frame comprising a frame including both a ground ring and a chip mounting board located therein. Extending between the ground ring and the chip mounting board are a plurality of elongate slots or apertures. The ground ring is formed to include recesses within the bottom surface thereof which create regions of reduced thickness. A semiconductor chip bonded to the chip mounting board may be electrically connected to leads of the lead frame and to the ground ring via conductive wires. Those conductive wires extending to the ground ring are bonded to the top surface thereof at locations which are not aligned with the recesses within the bottom surface, i.e., those regions of the ground ring of maximum thickness.
Claims21
A lead frame comprising:
- a frame;
- a ground ring disposed within the frame and defining:
- a generally planar first ground ring surface;
- a generally planar second ground ring surface disposed in opposed relation to the first ground ring surface;
- and
- a plurality of third ground ring surfaces formed between the first and second ground ring surfaces in opposed relation to the first ground ring surface;
- a chip mounting board disposed within the ground ring;
- a plurality of tie bars connected to and extending between the frame, the ground ring and the chip mounting board for supporting the ground ring and the chip mounting board within the frame;
- and
- a plurality of leads connected to the frame and extending about the periphery of the ground ring in spaced relation thereto.
A semiconductor package comprising:
- a lead frame comprising:
- a frame;
- a ground ring disposed within the frame and defining:
- a generally planar first ground ring surface;
- a generally planar second ground ring surface disposed in opposed relation to the first ground ring surface;
- and
- a plurality of third ground ring surfaces formed between the first and second ground ring surfaces in opposed relation to the first ground ring surface;
- a chip mounting board disposed within the ground ring;
- a plurality of tie bars connected to and extending between the frame, the ground ring and the chip mounting board for supporting the ground ring and the chip mounting board within the frame;
- a plurality of leads connected to the frame and extending about the periphery of the ground ring in spaced relation thereto;
- a semiconductor chip attached to the chip mounting board and including a plurality of input-output pads;
- at least two conductive wires mechanically and electrically connecting respective ones of the input-output pads of the semiconductor chip to respective ones of the ground ring and the leads;
- and
- a sealing part for sealing the chip mounting board, the ground ring, the tie bars, the leads, the semiconductor chip and the conductive wires, the sealing part being configured such that the second surface of the ground ring is exposed therewithin.
A semiconductor package comprising:
- a lead frame comprising:
- a chip mounting board;
- a ground ring circumventing the chip mounting board and defining:
- a generally planar first ground ring surface;
- a generally planar second ground ring surface disposed in opposed relation to the first ground ring surface;
- and
- a plurality of third ground ring surfaces formed between the first and second ground ring surfaces in opposed relation to the first ground ring surface;
- and
- a plurality of leads extending about the periphery of the ground ring in spaced relation thereto;
- a semiconductor chip attached to the chip mounting board and electrically connected to at least one of the leads;
- and
- a sealing part at least partially covering the chip mounting board, the ground ring, the leads, and the semiconductor chip such that the second surface of the ground ring is exposed therein.
Dependencies are inferred from the claim text.