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US 6,713,317 B2Granted
Semiconductor device and laminated leadframe package
AssigneeSemiconductor Components Industries, LLC
InventorsJames Knapp, Stephen St. Germain
Life of this patent
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Abstract
A method of making a semiconductor device (100) by attaching a top surface of a first laminate (630) to a bottom surface of a second laminate (650) to form a leadframe (620) and mounting a semiconductor die (102) to the leadframe to form the semiconductor device. The first semiconductor die is encapsulated with a molding compound (108) and material is removed from the first laminate to form a mold lock (120) with the molding compound.
Claims16
A method of making a semiconductor device, comprising:
- attaching a top surface of a first laminate to a bottom surface of a second laminate to form a leadframe;
- and
- mounting a first semiconductor die to the leadframe to form the semiconductor device.
A method of making a semiconductor device, comprising:
- mounting a first surface of a semiconductor die to a top surface of a first laminate;
- wherein the step-of mounting the first surface includes the step of electrically coupling the first surface of the semiconductor die to a first portion of the first laminate to form a first lead of the semiconductor device, and
- mounting a second laminate over the first laminate and to a second surface of the semiconductor die;
- wherein the step of mounting the second laminate includes the step of electrically coupling a second surface of the semiconductor die to a second portion of the first laminate to form a second lead of the semiconductor device.
1 more element
Dependencies are inferred from the claim text.