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US 6,713,314 B2Granted
Hermetically packaging a microelectromechanical switch and a film bulk acoustic resonator
AssigneeIntel Corporation
InventorsDaniel M. Wong, John Heck, Valluri Rao
Life of this patent
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Abstract
A film bulk acoustic resonator wafer and microelectromechanical switch wafer may be combined together in face-to-face abutment with sealing material between the wafers to define individual modules. Electrical interconnects can be made between the switch and the film bulk acoustic resonator within a hermetically sealed chamber defined between the switch and the film bulk acoustic resonator.
Claims11
A method comprising:
- forming a wafer with a microelectromechanical switch defined on a first face;
- forming a wafer with a film bulk acoustic resonator on a first face;
- and
- packaging said wafers in first face-to-first-face alignment.
1 more element
Dependencies are inferred from the claim text.