Multiple pass write method and reticle
AssigneeMicron Technology, Inc.
InventorEugene A. DeLaRosa
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Abstract
A multiple pass write method and a reticle made from the method are described. A reticle preform is provided including a transparent substrate, a metal layer, and a layer of a photoresist material. In a first write pass, a first portion of the photoresist material is exposed by an electron beam device. Then, in a second write pass, a second portion of the photoresist material is exposed. The first exposed portion is smaller or has finer dimensions than the second exposed portion. The exposed portions of photoresist material are removed, and the unexposed portions of photoresist serve as a mask. The uncovered portions of the conductive layer are etched. Further, the unexposed portions of the photoresist material are removed, creating a reticle through a multiple write pass strategy.
Claims8
A method of forming a reticle from a reticle preform comprising a metallic layer and a photoresist layer, the method comprising:
- exposing an entire thickness of a first portion of the photoresist layer in a first writing pattern, wherein the first portion comprises an outline of a pattern of the reticle to be formed;
- subsequently exposing an entire thickness of a second portion of the photoresist layer in a second writing pattern, wherein the second portion comprises the remainder of the pattern of the reticle;
- removing the exposed first and second portions;
- and
- etching the metallic layer beneath said removed first and second portions.
Dependencies are inferred from the claim text.