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US 6,713,230 B2Granted
Photosensitive ink composition
AssigneeNan Ya Plastics Corporation
InventorsChi-Ming Chang, Hsiao-Loung Lu, Chun-Che Tsao, Cheng-Li Chao, Chung-Chi Su
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AssigneeNan Ya Plastics Corporation
InventorsChi-Ming Chang, Hsiao-Loung Lu, Chun-Che Tsao, Cheng-Li Chao, Chung-Chi Su
Estimating the term…
Provided is a novel photosensitive resistive ink composition, comprising: (A) a photo curable prepolymer containing at least two ethylenically unsaturated bonds with an a,β-unsaturated carboxylic acid, represented by the formula I, (B) a photocurable monomer containing at least three vinyl groups and an a,β-unsaturated carboxylic acid, (C) a photo-initiator, (D) organic solvents, (E) an epoxy compound containing at least one vinyl group and one epoxy group in the molecule unit, (F) a curing agent capable of allowing a photocurable prepolymer (A) undergo a thermal reaction, and (G) a clay nano-composite capable of increasing the surface area of inorganic materials of the photosensitive resistive ink composition. The composition produces a solder mask film having a desired pattern after coating, exposure, development and postcuring and excellent in adhesiveness, resistance to chemicals, resistance to insulatiion, resistance to heat, developability, pot life, resistance to electroless gold plating, transparency of the photo-resist film and resolution.
A photosensitive resistive ink composition, which comprises (A) a photocurable prepolymer represented by the formula I in an amount of 10 to 80% weight of the photosensitive resistive ink composition which is prepared by reacting (a) epoxy compound containing at least two terminated epoxy groups with (b) an α,β-unsaturated monocarboxylic acid containing at least one vinyl group and then reacting with (c) a saturated or unsaturated polybasic acid anhydride, (B) a photo-curable monomer containing at least three vinyl groups and an α,β-unsaturated carboxylic acid represented by the formula II in an amount of 1 to 40% weight of the photosensitive resistive ink composition, (C) a photo-initiator in an amount of 0.5 to 10% weight of the photosensitive resistive ink composition, (D) organic solvents in an amount of 15 to 60% weight of the photosensitive resistive ink composition, (E) an epoxy compound containing at least one vinyl group and one epoxy group in the molecule unit represented by the general formula III in an amount of 1 to 60% weight of the photosensitive resistive ink composition, (F) a curing agent capable of allowing a photocurable prepolymer (A) undergo a thermal reaction in an amount of 0.1 to 15% weight of the photosensitive resistive ink composition, and (G) a clay nano-composite in an amount of 0.001 to 2% weight of the photosensitive resistive ink composition;
Dependencies are inferred from the claim text.