Thermosetting low-dielectric resin composition and use thereof
AssigneeTomegawa Paper Co., Ltd.
InventorsTakeshi Hashimoto, Masaharu Kobayashi, Takeshi Sato, Daisuke Orino
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Abstract
A thermosetting low-dielectric resin composition which has a low dielectric constant and a low dielectric tangent for use in a printed circuit board and which has excellent adhesion to a metal and scatters almost no resin when used for forming a prepreg by punching or cutting, the composition comprising a component (a): siloxane-modified polyimide, component (b): a compound containing 2 methylallyl groups and having the following formula (1) or a compound containing 3 allyl groups or 3 methylallyl groups and having the following formula (1A), and component (c): a compound containing at least 2 maleimide groups. wherein R is a hydrogen atom or methyl group.
Claims11
A laminated board comprising a prepreg sheet or prepreg sheets prepared by impregnating a reinforcing fiber material with the thermosetting low-dielectric resin composition comprising a component (a):
- siloxane-modified polyimide, component (b):
- a compound containing 3 allyl groups or 3 methylallyl groups and having the following formula (1A), and component (c):
- a compound containing at least 2 maleimide groups;
- wherein R is a hydrogen atom or methyl group.
A circuit laminate material comprising either a peeling-off layer or a metal foil and the thermosetting low-dielectric resin composition comprising a component (a):
- siloxane-modified polyimide, component (b):
- a compound containing 3 allyl groups or 3 methylallyl groups and having the following formula (1A), and component (c):
- a compound containing at least 2 maleimide groups:
- wherein R is a hydrogen atom or methyl group, which thermosetting low-dielectric resin composition is an adhesive layer laminated one surface of the peeling-off layer or the metal foil.
A circuit laminate material comprising either a peeling-off layer or a metal foil and the thermosetting low-dielectric resin composition comprising a component (a):
- siloxane-modified polyimide, component (b):
- a compound containing 2 methylally groups and having the following formula (1or a compound containing 3 allyl groups or 3 methylallyl groups and having the following formula (1A), and component (c):
- a compound containing at least 2 maleimide groups:
- wherein R is a hydrogen atom or methyl group, which thermosetting low-dielectric resin composition is an adhesive layer laminated one surface of the peeling-off layer or the metal foil,
- wherein the adhesive layer has a peeling-off layer formed on one surface opposite to the metal foil or the film.
Dependencies are inferred from the claim text.