Substrate processing system and substrate processing method
AssigneeTokyo Electron Limited
InventorsYuji Fukuda, Kunie Ogata
Life of this patent
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Abstract
A coating unit for coating a substrate with a treatment solution and a peripheral aligner, which has a mounting table rotatable and movable in at least one direction and irradiates the peripheral portion of the substrate on the mounting table with light from an irradiating portion to expose a coating film on the substrate, are provided in a substrate processing system. The peripheral aligner has film thickness measuring means provided with a sensor member for measuring a film thickness of the coating film. It is not necessary to separately provide a unit for measuring the film thickness outside of the system, thus preventing the substrate from being contaminated or dropped to be damaged when the film thickness is measured.
Claims10
A method of processing a substrate with use of a substrate processing system,
- wherein said substrate processing system comprises a peripheral aligner for irradiating the peripheral portion of the substrate with light to expose a coating film applied on the substrate;
- and
- wherein said peripheral aligner comprises a film thickness sensor for measuring a film thickness of the coating film inside said peripheral aligner, the method comprising the step of:
- irradiating the peripheral portion of the substrate with the light inside said peripheral aligner to expose the coating film after measuring the film thickness of the coating film on the substrate with the use of said film thickness sensor inside said peripheral aligner.
Dependencies are inferred from the claim text.