Polishing-product discharging device and polishing device

A polishing apparatus for polishing a workpiece, comprising:

• a bonded-abrasive element including abrasive particles and a binder material binding said abrasive particles;
• a dressing component for dressing said bonded-abrasive element;
• and
• a fluid ejection nozzle for ejecting fluid onto a surface of said bonded-abrasive element so as to discharge debris from said surface of said bonded-abrasive element, wherein said bonded-abrasive element, said dressing component, and said fluid ejection nozzle are arranged such that the polishing of the workpiece and dressing of said bonded-abrasive element are performed simultaneously;
• wherein said bonded-abrasive element is operable to rotate, and said fluid ejection nozzle is arranged downstream of said dressing component with respect to the rotation of said bonded-abrasive element.

A polishing apparatus for polishing a workpiece, comprising:

• a bonded-abrasive element including abrasive particles and a binder material binding said abrasive particles, said bonded-abrasive element being operable to rotate;
• a dressing component for dressing said bonded-abrasive element;
• and
• a fluid ejection nozzle for ejecting fluid onto a surface of said bonded-abrasive element so as to discharge debris from said surface of said bonded-abrasive element, wherein said bonded-abrasive element, said dressing component, and said fluid ejection nozzle are arranged such that the polishing of the workpiece and dressing of said bonded-abrasive element are performed simultaneously;
• and
• a trapping jig arranged downstream of said dressing component with respect to the rotation of said bonded-abrasive element, said trapping jig being operable to trap the debris on said surface of said bonded-abrasive element.

A polishing apparatus for polishing a workpiece, comprising:

• a base;
• a bonded-abrasive element including abrasive particles and a binder binding said abrasive particles, said bonded-abrasive element being bonded by an adhesive layer to said base such that a polishing surface of said bonded-abrasive element faces away from said base;
• and
• a plurality of grooves cut through said bonded-abrasive element and said adhesive layer such that a depth of each of said grooves extends from said polishing surface to a surface of said base;
• and
• a fluid ejection nozzle arranged in each of said grooves so as to eject a fluid through each of said grooves for removing debris therefrom.

A polishing apparatus comprising:

• a polishing component having a bonded-abrasive surface for contacting a surface of a substrate to be polished such that the surface of the substrate is polished as the surface of the substrate and said bonded-abrasive surface of said polishing component move relative to each other, said bonded-abrasive surface being operable to rotate;
• a debris trapping device operable to press against said bonded-abrasive surface during polishing of the substrate so as to trap debris on said bonded-abrasive surface;
• and
• a debris discharging device for discharging the debris trapped by said debris trapping device on said bonded-abrasive surface, said debris trapping device comprising a trapping jig arranged downstream of said fluid device with respect to a rotation of said bonded-abrasive surface.