Method and apparatus for applying downward force on wafer during CMP
AssigneeLam Research Corporation
InventorsAnthony de la Llera, Xuyen Pham, Andrew Siu, Tuan A. Nguyen, Tony Luong
Life of this patent
Estimating the term…
Abstract
An apparatus for applying a wafer to a polishing belt during a CMP operation includes a spindle having an upper end and a lower end. A wafer carrier is coupled to the lower end of the spindle. A linear force generator is disposed at the upper end of the spindle. A load cell is positioned between the linear force generator and the upper end of the spindle. A controller is coupled to the load cell for controlling the force applied by the linear force generator. A method for applying downward force on a wafer during CMP also is described.
Claims10
An apparatus for applying a wafer to a polishing surface during a chemical mechanical planarization (CMP) operation, comprising:
- a spindle having an upper end and a lower end;
- a wafer carrier coupled to the lower end of the spindle;
- a linear force generator disposed at the upper end of the spindle having a bladder;
- a load cell positioned between the linear force generator and the upper end of the spindle;
- and
- a controller coupled to the load cell for controlling the force applied by the linear force generator.
An apparatus for applying a wafer to a polishing surface during a chemical mechanical planarization (CMP) operation, comprising:
- a spindle having an upper end and a lower end;
- a wafer carrier coupled to the lower end of the spindle;
- a load cell plate coupled to the upper end of the spindle;
- a load cell disposed on the load cell plate;
- a lower plate disposed on the load cell;
- an upper plate supported above the lower plate;
- and
- a bladder positioned between the lower plate and the upper plate.
An apparatus for applying a wafer to a polishing surface during a chemical mechanical planarization (CMP) operation, comprising:
- a spindle having an upper end and a lower end;
- a wafer carrier coupled to the lower end of the spindle;
- a linear force generator disposed at the upper end of the spindle having a motor capable of providing force in a controllable manner;
- a load cell positioned between the linear force generator and the upper end of the spindle;
- and
- a controller coupled to the load cell for controlling the force applied by the linear force generator.
An apparatus for applying a wafer to a polishing surface during a chemical mechanical planarization (CMP) operation, comprising:
- a spindle having an upper end and a lower end;
- a wafer carrier coupled to the lower end of the spindle;
- a linear force generator disposed at the upper end of the spindle having a hydraulic device capable of providing force in a controllable manner;
- a load cell positioned between the linear force generator and the upper end of the spindle;
- and
- a controller coupled to the load cell for controlling the force applied by the linear force generator.
Dependencies are inferred from the claim text.