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US 6,712,261 B2Granted
Solid conductive element insertion apparatus
AssigneeInternational Business Machines Corporation
InventorsRichard R. Hall, How T. Lin, Christopher J. Majka, Matthew F. Seward, Ronald V. Smith
Life of this patent
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Abstract
An arrangement and method for the insertion the leading end of a length of a metallic element into a through hole which is formed in a substrate, and for heat deforming the inserted leading portion of the metallic element into a predetermined configuration prior to severing therefrom the remaining length of the metallic element.
Claims20
A method of inserting a conductive material into a through-hole provided in a substrate;
- comprising the steps of:
- aligning a continuous length of said conductive material with said hole;
- advancing the leading end of said conductive material into said hole;
- imparting heat to the portion of the conductive material which has been inserted into said hole so as to melt said portion and form a conductive insert in said hole;
- and
- severing the remaining conductive material extending outwardly of said hole from said formed conductive insert.
3 more elements
An arrangement for inserting a conductive material into a hole provided in a substrate;
- comprising:
- a device for aligning a continuous length of said conductive material with said hole;
- said device advancing the leading end of said conductive material into said hole;
- a heat generating device for imparting heat to the portion of the conductive material which has been inserted into said hole so as to melt said portion and form a conductive insert in said hole;
- and
- cutting structures for severing the remaining conductive material extending outwardly of said hole from said formed conductive insert.
3 more elements
Dependencies are inferred from the claim text.