Integrated quantum cold point coolers
AssigneeInternational Business Machines Corporation
InventorUttam Shyamalindu Ghoshal
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Abstract
A method for forming a thermoelement for a thermoelectric cooler is provided. In one embodiment a first substrate having a plurality of pointed tips separated by valleys wherein the substrate is covered by a metallic layer, portions of the metallic layer is covered by an insulator, and other portions of the metallic layer are exposed is formed. The other portions of the metallic layer that are exposed are covered with a thermoelectric material overcoat. A second substrate of thermoelectric material is then fused to the pointed tip side of the first substrate by, for example, heating the back of the first substrate to melt the thermoelectric material overcoat or by passing current through the pointed tips to induce Joule heating and thereby melt the thermoelectric material overcoat.
Claims19
A method for forming a thermoelement for a thermoelectric cooler, the method comprising:
- forming a first substrate having a plurality of pointed tips covered by a metallic layer, portions of the metallic layer being covered by an insulating material, and other portions of the metallic layer being exposed;
- covering portions of the metallic layer that are exposed with a thermoelectric material overcoat;
- and
- fusing a second substrate of thermoelectric material to the thermoelectric material overcoat.
A system for forming a thermoelement for a thermoelectric cooler, the system comprising:
- means for forming a first substrate having a plurality of pointed tips covered by a metallic layer, portions of the metallic layer being covered by an insulating material, and other portions of the metallic layer being exposed;
- means for covering portions of the metallic layer that are exposed with a thermoelectric material overcoat;
- and
- means for fusing a second substrate of thermoelectric material to the thermoelectric material overcoat.
A method for forming a thermoelement for use in a thermoelectric cooler, the method comprising:
- forming a first substrate having a plurality of pointed tips covered with a thermoelectric overcoat;
- fusing a second substrate of thermoelectric material to the pointed tips of the first substrate.
A thermoelectric cooler, comprising:
- a first substrate having a plurality of pointed tips, the apexes of the tips having a selectively deposited overcoat thermoelectric material;
- a second substrate of planar thermoelectric material;
- and
- fused connections between the overcoat thermoelectric material and the planar thermoelectric material.
Dependencies are inferred from the claim text.