US 6,712,257 B2 · Indirect imaging method for a bonding tool

Abstract

A vision system and method for use with a bonding tool that takes into account variations due to temperature changes and other nonrandom systemic effects. The vision system includes a cornercube offset tool having a plurality of total internal reflection surfaces, the cornercube offset tool located below the vision plane of the optical system; and an optical detector to receive an indirect image of the bonding tool through the cornercube offset tool. The method comprises the steps of providing a cornercube offset tool having a plurality of total internal reflection surfaces below a vision plane of the bonding tool; and receiving an indirect image of the bonding tool through the cornercube offset tool.

Claims4

Dependent claims

A method for viewing a position of a bonding tool, the method comprising the steps of:

providing a cornercube offset tool below a vision plane of the bonding tool;
and
viewing an indirect image of the bonding tool through the cornercube offset tool.

Dependencies are inferred from the claim text.

Facts

Application

10/075,576Filed 13 Feb 2002 · division

Priority

24 Jul 2001

Published

US 2003/0019911 A130 Jan 2003

Granted

30 Mar 2004

Term ends

Not estimatedThe source records don’t support an estimate.

Classification5 codes

B23K 31/12
Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups…:…
B23K 20/002
Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating: specially adapted…
B23K 20/10
Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating: making use of…
B23K 2101/40
Electric or electronic devices: semiconductor devices

Indirect imaging method for a bonding tool

Life of this patent

Indirect imaging method for a bonding tool

Life of this patent

Abstract

Claims4