Heat dissipation device comprised of multiple heat sinks
AssigneeTaiwan TriGem Information Co., Ltd.
InventorKuo-Shao Lee
Life of this patent
Estimating the term…
Abstract
A heat dissipation device includes a multiple heat sink structure for enhanced heat removal. The multiple heat sin structure includes a contact pad positionable on a heat generating device, such as a central processing unit, and two heat sinks arranged on opposite sides of the contact pad and each directly and thermally coupled to the contact pad by heat pipes. A number of heat-radiating fins are attached or formed on each heat sink. Fans are coupled to the heat sinks by dir passages for providing air stream to induce forced convection.
Claims19
A heat dissipation device comprising a contact pad made of heat conductive material, a plurality of heat pipes and at least two heat sinks, the heat pipes being in physical engagement with the contact pad aid extending from sides of the contact pad to thermally couple to the heat sinks, a fan assembly being provided in correspondence to the heat sinks, wherein the beat sinks are coupled to a too shell of the fan assembly by spring-biased fasteners, the fan assembly comprising at least one fan mounted within the top shell.
A heat dissipation device comprising a contact pad made of heat conductive material, at least two heat sinks, a plurality of heat pipes being in physical engagement with the contact pad and extending from sides of the contact pad to thermally couple to the heat sinks, and an air stream generation unit having a plurality of air passages each connecting a respective heat sink to at least one fan.
Dependencies are inferred from the claim text.