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US 6,712,111 B2Granted
Bonding method and apparatus
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsTetsuya Tokunaga, Takahiro Yonezawa, Hiroyuki Kiyomura, Tatsuo Sasaoka
Life of this patent
Estimating the term…
Abstract
A carrier tool having a protective ring with a sheet extended over an underside of the ring is used, a semiconductor wafer is made to adhere to the sheet, the semiconductor wafer, being surrounded by the protective ring, is carried from a container device to a bonding stage. Bonding is performed on the bonding stage, and the wafer is carried out to another container device, consequently damage of the wafer is avoided.
Claims20
A bonding method comprising the procedures of:
- making a semiconductor wafer adhere to a sheet of a carrier tool having a protective ring with the sheet extended over an underside of the protective ring;
- arranging through-holes in the sheet at positions below the semiconductor wafer to enable suction to be applied through the through-holes to cause adherence of the semiconductor wafer to the sheet;
- carrying the semiconductor wafer while surrounded by the protective ring from a first container device to a bonding stage;
- performing a bonding to the semiconductor wafer on the bonding stage while the semiconductor wafer is held on the bonding stage;
- and
- carrying the wafer out of the bonding stage to a second container device.
3 more elements
A bonding apparatus comprising:
- a carrier tool for holding a semiconductor wafer, the carrier tool having a sheet to which the semiconductor wafer is adhered, and a protective ring arranged on the sheet so as to surround the semiconductor wafer, the sheet including through-holes arranged at positions below the semiconductor wafer to enable suction to be applied through the through-holes to cause adherence of the semiconductor wafer to the sheet;
- a carry-in side container for containing the carrier tool holding the semiconductor wafer;
- a bonding stage for adherently holding the semiconductor wafer via the sheet of the carrier tool;
- a bonding device for performing bonding to the semiconductor wafer held on the bonding stage;
- a carry-in device for adherently holding the protective ring of the carrier tool holding the semiconductor wafer, and transferring the carrier tool from the carry-in side container device to the bonding stage;
- a carry-out side container for containing the carrier tool holding the semiconductor wafer;
- and
- a carry-out device for adherently holding the protective ring of the carrier tool holding the semiconductor wafer, and transferring the carrier tool from the bonding stage to the carry-out side container device.
5 more elements
A bonding method comprising the steps of:
- making a semiconductor wafer adhere to a sheet of a carrier tool having a protective ring with the sheet extended over an underside of the protective ring;
- carrying the semiconductor wafer while surrounded by the protective ring from a first container device to a bonding stage;
- holding the semiconductor wafer on the bonding stage by adherently holding the wafer via the sheet by means of a suction device which applies suction through a plurality of suction holes in the bonding stage located in positions corresponding to a border of the semiconductor wafer or through a suction hole with an annular groove in the bonding stage located in a position corresponding to a border of the semiconductor wafer, the plurality of suction holes or the suction hole with the annular groove opening to an upper face of the bonding stage;
- arranging through-holes in the sheet at positions corresponding to the positions of the plurality of suction holes or to the position of the suction hole with the annular groove to enable suction to be applied through the through-holes to cause adherence of the semiconductor wafer to the sheet;
- performing a bonding to the semiconductor wafer on the bonding stage while the semiconductor wafer is held on the bonding stage;
- and
- carrying the wafer out of the bonding stage to a second container device.
4 more elements
A bonding method comprising the steps of:
- making a semiconductor wafer adhere to a sheet of a carrier tool having a protective ring with the sheet extended over an underside of the protective ring;
- carrying the semiconductor wafer while surrounded by the protective ring from a first container device to a bonding stage;
- performing a bonding to the semiconductor wafer on the bonding stage while the semiconductor wafer is held on the bonding stage;
- holding the semiconductor wafer on the bonding stage by adherently holding the wafer via the sheet by means of a suction device which applies suction through a porous plate arranged on the bonding stage;
- carrying the wafer out of the bonding stage to a second container device;
- and
- arranging through-holes in the sheet to enable suction to be applied through the through-holes to cause adherence of the semiconductor wafer to the sheet.
4 more elements
Dependencies are inferred from the claim text.