Process for manufacturing a conductive wire suitable for use in semiconductor packages
AssigneeAsep Tec Co., Ltd.
InventorPen-Tien Liao
Life of this patent
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Abstract
In a process for manufacturing a conductive wire that is suitable for use in semiconductor packages, a core wire of an extensible metal other than gold is first prepared to have a diameter ranging from 300 μm to 500 μm. Thereafter, a gold-containing outer layer having a thickness ranging from 2.5 μm to 25 μm is plated onto an outer surface of the core wire so as to form a gold-plated core wire. Subsequently, the gold-plated core wire is drawn to result in the conductive wire having a diameter ranging from 1 μm to 50 μm.
Claims4
A process for manufacturing a conductive wire suitable for use in semiconductor packages, comprising the steps of:
- preparing a core wire of an extensible metal other than gold, said core wire having a diameter ranging from 300 μm to 500 μm and an outer surface;
- plating a gold-containing outer layer having a thickness ranging from 2.5 μm to 25 μm onto said outer surface of said core wire so as to form a gold-plated core wire;
- and
- drawing said gold-plated core wire into said conductive wire having a diameter ranging from 1 μm to 50 μm such that said gold-containing outer layer has a thickness ranging from 0.0125 μm to 2.5 μm after said drawing step.
Dependencies are inferred from the claim text.