Method of making printed circuit board having inductive vias

Abstract

A method for increasing the impedance of a via for providing a conductive path through a printed circuit board is disclosed. The method comprises the steps of forming a conductive pad on the printed circuit board, forming a non-threaded opening extending through the conductive pad and through the printed circuit board to form an annular conductive pad surrounding the non-threaded opening, forming a conductive metal barrel lining the inner wall of the non-threaded opening connected to the annular conductive pad, and cutting material from the metal barrel to leave at least one conductive strip extending axially along the inner wall of the opening without cutting material from the annular conductive pad so that the at least one conductive strip is connected to an undivided annular conductive pad.

Dependencies are inferred from the claim text.