Method of making metal core substrate printed circuit wiring board enabling thermally enhanced ball grid array (BGA) packages
AssigneeUnicap Electronics Industrial Corporation
InventorsJane Lu, Paul Wu, Ray Chen, Scott Chen, Jeff Chang
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Abstract
A method of making a thermally enhanced BGA substrate in which a metal (copper) core, has dielectric layers applied to each side thereof and conductive through-core build-up vias are provided. Rigidifying non-conductive dielectric sheets are laminated to the oppositely facing surfaces and then conductive layers are applied to at least one of the rigidifying non-conductive sheets and via connections are made through the dielectric layer(s) to the core conductive layer.
Claims11
A method of making a thermally enhanced printed circuit wiring board substrate for ball grid integrated circuit packages comprising the steps of:
- a) providing an initial thin conductive metal core having oppositely facing surfaces,
- b) forming one or more holes in said metal core at each of a plurality of through-core via sites,
- c) laminating a thin rigidifying non-conductive dielectric sheet to each said oppositely facing surfaces, respectively,
- d) forming at least one via to said metal core in one of said dielectric sheets,
- e) applying at least one thin conductive layer on a surface of one of said thin rigidifying non-conductive sheets and making at least one electrical connection to said initial thin conductive metal core at said at least one via to said metal core.
A method of making a thermally enhanced printed circuit wiring board substrate for ball grid integrated circuit packages comprising the steps of:
- a) providing an initial thin conductive metal core having oppositely facing surfaces,
- b) forming one or more holes in said metal core at each of a plurality of through-core via sites,
- c) laminating a thin rigidifying non-conductive dielectric sheet to each said oppositely facing surfaces, respectively, so that at least one exposed surface of the non-conductive dielectric sheet facing outwardly, respectively,
- d) applying at least one thin conductive layer on said at least one exposed surface of non-conductive dielectric sheet, and
- e) forming a conductive connection between said thin conductive layer on said surface through one of said through-core via sites.
Dependencies are inferred from the claim text.