Coil device
AssigneeMurata Manufacturing Co., Ltd.
InventorsKatsuji Matsuta, Kenichi Ito, Masahiko Kawaguchi
Life of this patent
Estimating the term…
Loading patent…
AssigneeMurata Manufacturing Co., Ltd.
InventorsKatsuji Matsuta, Kenichi Ito, Masahiko Kawaguchi
Estimating the term…
A coil device includes a first magnetic substrate, a laminated body disposed on the first magnetic substrate and having insulating layers, coil patterns, and at least one through-hole, a magnetic layer covering the upper surface of the laminated body, an adhesive layer disposed on the magnetic layer, and a second magnetic substrate disposed on the adhesive layer and bonded to the magnetic layer via the adhesive layer. The insulating layers defining an insulator and the coil patterns for forming a coil are alternately stacked so that the coil patterns are arranged in the insulator, the through-hole is located at an area where the coils are not located and extends from the upper surface of the laminated body to the first magnetic substrate. The magnetic layer has at least one portion extending through the through-hole to contact the first magnetic substrate. The adhesive layer is nonmagnetic, and the laminated body is sandwiched between the first and second substrates.
A coil device comprising:
A coil device comprising:
Dependencies are inferred from the claim text.