Method of fabricating stacked die configurations utilizing redistribution bond pads
AssigneeMicron Technology, Inc.
InventorMichel Koopmans
Life of this patent
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Abstract
A stacked semiconductor package including a plurality of stacked semiconductor devices on a substrate, and a method of forming the same. The semiconductor devices are stacked in an active surface-to-backside configuration. The top semiconductor die is flipped over to face the active surface of the semiconductor die directly below. An electrical connector can extend from a bond pad on the top semiconductor die to a redistribution circuit on the semiconductor die below. The redistribution circuit can be electrically connected to a substrate. Alternatively, an electrical connector extends from a bond pad on the top semiconductor die to a bond pad on a substrate.
Claims49
A method of forming a stacked semiconductor assembly, comprising:
- providing a first semiconductor die including an active surface and a back side, the active surface including, a plurality of bond pads, a plurality of redistribution pads and a plurality of metal traces thereon, the plurality of redistribution pads electrically independent from integrated circuitry in the first semiconductor die, at least one metal trace of the plurality of metal traces connecting at least a first redistribution pad of the plurality of redistribution pads and at least a second redistribution pad of the plurality of redistribution pads;
- providing a second semiconductor die including an active surface and a back side, the active surface of the first semiconductor die facing the active surface of the second semiconductor die, the active surface of the second semiconductor die including a plurality of bond pads thereon;
- electrically connecting the first redistribution pad of the first semiconductor die and a corresponding bond pad of the plurality of bond pads of the second semiconductor die;
- and
- electrically connecting the second redistribution pad of the first semiconductor die and a corresponding contact area of a substrate.
A method of forming a stacked semiconductor package, comprising:
- providing a substrate including a plurality of contact areas;
- providing a first semiconductor die including an active surface, a back side, and a plurality of peripheral edges, the back side disposed above the substrate, the active surface including a plurality of bond pads thereon;
- at least one redistribution bond pad circuit on the active surface of the first semiconductor die, the at least one redistribution bond pad electrically independent from integrated circuitry of the first semiconductor die and including a plurality of redistribution bond pads;
- disposing a top semiconductor die above the first semiconductor die, the top semiconductor die including an active surface, a back side and a plurality of peripheral edges, the active surface of the top semiconductor die facing the active surface of the first semiconductor die and including a plurality of bond pads thereon, at least one edge of the plurality of peripheral edges of the top semiconductor die extending laterally beyond at least one corresponding peripheral edge of the plurality of peripheral edges of the first semiconductor die;
- and
- extending at least one conductive element between at least one bond pad of the plurality of bond pads on the top semiconductor die and a corresponding contact area of the plurality of contact areas of the substrate adjacent to the at least one corresponding peripheral edge of the first semiconductor die.
A method of designing a semiconductor device to be used as a lower semiconductor device in a stacked semiconductor assembly, the method comprising:
- providing a first semiconductor device including an active surface and a back side, the active surface including and a plurality of bond pads thereon;
- and
- designing at least one redistribution circuit on the active surface, the at least one redistribution circuit independent from integrated circuitry in the first semiconductor device.
A method for redistributing bond pads of a semiconductor device, the method comprising:
- providing a semiconductor device including an active surface having a first set of substantially centrally located bond pads and a second set of substantially peripherally located bond pads thereon, the second set of substantially peripherally located bond pads and the first set of substantially centrally located bond pads are electrically independent from the semiconductor device integrated circuitry;
- and
- electrically connecting at least one bond pad of the first set of substantially centrally located bond pads to a corresponding second bond pad of the second set of substantially peripherally located bond pads.
Dependencies are inferred from the claim text.