Miniature optical element for wireless bonding in an electronic instrument
AssigneeSeiko Epson Corporation
InventorKenji Wada
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Abstract
A method of manufacturing an optical element including the steps of: forming a through hole in a semiconductor element which has an optical section and an electrode electrically connected to the optical section; and forming a conductive layer extending from a first surface of the semiconductor element on which the optical section is formed, through an inner wall surface of the through hole, to a second surface opposite to the first surface.
Claims11
An optical element comprising a semiconductor chip, the semiconductor chip having a first surface including an optical section and an electrode electrically connected to the optical section, the semiconductor chip having a second surface opposite to the first surface,
- wherein the semiconductor chip includes a through hole and a conductive layer electrically connected to the electrode, the conductive layer extending from the first surface through the through hole to the second surface for mounting of the optical element without wire bonding.
An electronic instrument comprising an optical element which includes a semiconductor chip having a first surface including an optical section and an electrode electrically connected to the optical section, the semiconductor chip having a second surface opposite to the first surface,
- wherein the semiconductor chip has a through hole and a conductive layer electrically connected to the electrode, the conductive layer formed from the first surface through the through hole to the second surface for mounting of the optical element without wire bonding.
Dependencies are inferred from the claim text.