Methods and systems for determining at least four properties of a specimen

A method for fabricating a semiconductor device, comprising:

• forming a portion of the semiconductor device upon a specimen;
• generating one or more output signals with a plurality of measurement devices, wherein the one or more output signals are responsive to at least four properties of the specimen;
• and
• processing the one or more output signals to determine the at least four properties of the specimen, wherein the at least four properties comprise a critical dimension of the specimen, overlay misregistration of the specimen, a presence of defects on the specimen, and a thin film characteristic of the specimen.

A system configured to determine at least four properties of a specimen during use, comprising:

• a plurality of measurement devices, wherein the plurality of measurement devices are configured to generate one or more output signals responsive to the at least four properties of the specimen;
• a local processor coupled to the plurality of measurement devices, wherein the local processor is configured to at least partially process the one or more output signals during use;
• and
• a remote controller computer coupled to the local processor, wherein the remote controller computer is configured to receive the at least partially processed one or more output signals during use and to determine the at least four properties of the specimen during use, and wherein the at least four properties comprise a critical dimension of the specimen, overlay misregistration of the specimen, a presence of defects on the specimen, and a thin film characteristic of the specimen.

A method for determining at least four properties of a specimen, comprising:

• generating one or more output signals with a plurality of output signals, wherein the one or more output signals are responsive to at least four properties of the specimen;
• and
• processing the one or more output signals to determine the at least four properties of the specimen, wherein the at least four properties comprise a critical dimension of the specimen, overlay misregistration of the specimen, a presence of defects on the specimen, and a thin film characteristic of the specimen, wherein processing the one or more output signals comprises:
• at least partially processing the one or more output signals using a local processor, wherein the local processor is coupled to the plurality of measurement devices;
• sending the partially processed one or more output signals from the local processor to a remote controller computer;
• and
• further processing the partially processed one or more output signals using the remote controller computer.