Off-chip signal routing between multiply-connected on-chip electronic elements via external multiconductor transmission line on a dielectric element
AssigneeTessera, Inc.
InventorsThomas H. DiStefano, John W. Smith
Life of this patent
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Abstract
A semiconductor chip is provided with a dielectric element having conductive features interconnecting electronic elements within the chip with one another. The conductive features replace internal conductors, and can provide enhanced signal propagation between elements of the chip. The conductive features on the dielectric element are connected to contacts on the chip by deformable conductive elements such as flexible leads so that the dielectric element remains movable with respect to the chip. The dielectric element may have a coefficient of expansion different from that of the chip itself.
Claims16
A microelectronic assembly including:
- (a) a first semiconductor chip including a plurality of electronic elements adapted to receive and send signals and a front surface having contacts thereon, at least some of said electronic elements being connected to said contacts;
- (b) a dielectric element separate from said chip, said dielectric element having a plurality of conductive features thereon, said conductive features including at least one set of plural conductive features defining a multiconductor transmission line extending between spaced-apart locations on said dielectric element, said electronic elements of said chip including at least one pair of multiply-connected elements, each said pair of multiply-connected elements being connected to one another through the plural conductive features of one said transmission line.
Dependencies are inferred from the claim text.