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US 6,687,133 B1Granted
Ground plane on 2 layer PBGA
AssigneeLSI Logic Corporation
InventorsWee K. Liew, Hong T. Lim, Chengyu Guo
Life of this patent
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AssigneeLSI Logic Corporation
InventorsWee K. Liew, Hong T. Lim, Chengyu Guo
Estimating the term…
A two layer PBGA which includes a metal ground plane at its bottom layer. The ground plane is preferably a metal plane which is connected to ground through a metal connection to a ball pad at the center of the package and a ball pad proximate the edge of the package. The ground plane is voided around the signal and power balls, via and “dog bones”. The PBGA is configured such that the ground plane serves effectively the same function as the second layer ground plane in a conventional four layer PBGA. The PBGA provides a cheaper alternative to the generally more expensive four layer PBGA, and provides better cross talk performance (especially for high frequency signaling) as well as better thermal performance as a result of having more metal at the bottom layer of the package.
A two layer Plastic Ball Gate Array (PBGA) package comprising a top layer having an integrated circuit disposed thereon and a non-tape bottom layer, said bottom layer comprising a metal plane which is connected to ground, wherein the metal plane spans proximate a peripheral edge of the package to a center of the package, wherein the bottom layer includes signal and power balls and the metal plane is voided around the signal and power balls, wherein the metal plane is grounded through metal connections to a ball pad proximate the center of the package and to a ball pads at the peripheral edge of the package.
Dependencies are inferred from the claim text.