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US 6,687,131 B1Granted
Transponder and injection-molded part and method for manufacturing same
AssigneeSokymat S.A.
InventorMartin Miehling
Life of this patent
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AssigneeSokymat S.A.
InventorMartin Miehling
Estimating the term…
A transponder contains an integrated circuit, a power transmitting component (antenna) and a capsule made of a thermoplastic resin (hot glue) that surrounds the circuit continuously at least on one surface of the circuit. The glue preferably is a polyamide and surrounds the circuit protectively, ensuring a mechanical connection between the circuit and the antenna. The encapsulation with the hot glue is conducted at pressures and temperatures that are below the pressures and temperatures encountered during conventional injection molding. The transponder can be integrated into an injection molded part, for example a coin, by being placed in an injection mold in which it is supported by feet and then surrounded by molding material in a conventional injection molding process so that it develops a more resistant sheath.
An electrical circuit comprised in integrated circuit, an antenna and one or more electrical connections between the integrated circuit and the antenna, wherein at least the integrated circuit and the antenna are encapsulated within a capsule such that the capsule mechanically connects the integrated circuit and the antenna to hold the integrated circuit and the antenna in a fixed position relative to each other, and wherein the capsule comprises a polyamide thermoplastic resin having a melting point of from 120° C. to 250° C. and a processing pressure of from 5 to 40 bar.
Transponder according to claim 8, wherein the polyamide resin of the capsule contacts the integrated circuit and the antenna.
Transponder comprising an electrical circuit containing at least one component suitable for interaction with an electromagnetic field encapsulated within a capsule, wherein the capsule comprises a polyamide thermoplastic resin having a melting point of from 120° C. to 250° C. and a processing pressure of from 5 to 40 bar, and wherein the electrical circuit is encapsulated by the polyamide thermoplastic resin such that at least an integrated circuit and an antenna of the electrical circuit are encapsulated by the polyamide thermoplastic resin and are mechanically connected by the polyamide thermoplastic resin to hold the integrated circuit and the antenna in a fixed position relative to each other.
Dependencies are inferred from the claim text.