Head suspension assembly with head amplifier IC

#1. Field of the Invention

#The present invention relates to a head suspension assembly in which a head amplifier IC chip is mounted.

#2. Description of the Related Art

#The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention, and together with the general description given above and the detailed description of the embodiments given below, serve to explain the principles of the invention.

#FIG. 1 is a plan view of a head suspension assembly according to an embodiment of the present invention;

#FIG. 2 is an enlarged sectional view of a head amplifier IC mounted portion in the head suspension assembly;

#A head suspension assembly according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

#As shown in FIG. 1, a head suspension assembly (hereinafter referred to as HSA) 10 comprises an arm 12, and a suspension 14 whose base end is fixed to a distal end of the arm 12 by spot welding or adhesive and which extends from the arm 12. The arm 12 formed in a shape of a thin flat plate with thickness of about 250 μm by, for example, a stainless steel-based material such as SUS304, and a circular through hole 15 is formed in a base end of the arm. The suspension 14 is constituted of an elongated leaf spring with a thickness of 60 to 70 μm. The suspension 14 may be formed integrally with the arm 12 by the same material as that of the arm.

#The HSA 10 is attached to a bearing assembly of a magnetic disk apparatus by passing a hub of the bearing assembly through the through hole 15 of the arm 12, and rotated around the bearing assembly by a voice coil motor as a drive mechanism. Moreover, when the HSA 10 rotates, the distal end of the suspension 14 moves substantially in a radial direction of a magnetic disk.