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US 6,686,825 B2Granted
Chip inductor and manufacturing method therefor
AssigneeMurata Manufacturing Co., Ltd.
InventorsEita Tamezawa, Keishiro Amaya
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AssigneeMurata Manufacturing Co., Ltd.
InventorsEita Tamezawa, Keishiro Amaya
Estimating the term…
A chip inductor has electrode layers, insulating layers disposed on the electrode layers, and an uppermost insulating layer all disposed on a ceramic board. An inorganic pigment such as a Co oxide or an Al oxide is added to the insulating layer at a concentration of from about 2% to about 20% by weight. Break grooves are formed in the form of a lattice on the insulating layer by a laser beam irradiation, and the board is divided along the grooves. By adding the inorganic pigment, the break grooves are effectively formed, and the mother board is divided accurately along the break grooves, such that a chip inductor having an increased L value and an increased Q value is produced.
A chip inductor comprising:
Dependencies are inferred from the claim text.
Drawings are temporarily unavailable. Open the PDF at USPTO
From the US filing history. Foreign family members aren’t listed.
Resistors, capacitors or inductors: inductors
Printed inductances: with stacked layers
For manufacturing coils: printed circuit coils
Integrated devices formed in or on semiconductor substrates that comprise only semiconducting
Term ended 9 May 2021 (estimated)
1. Field of the Invention
The present invention relates to a chip inductor and a manufacturing method therefor. More particularly, the present invention relates to a chip inductor manufactured by providing electrode layers having specific patterns and insulating layers on a ceramic mother board, followed by dividing the mother board, and to a method for manufacturing the chip inductor.
2. Description of the Related Art
FIGS. 1A to 1C are cross-sectional views illustrating the manufacturing steps for a chip inductor according to the first preferred embodiment of the present invention.
FIGS. 2A and 2B are cross-sectional views illustrating the manufacturing steps for a chip inductor according to the second preferred embodiment of the present invention.
Preferred embodiments of a chip inductor and a manufacturing method therefor according to the present invention will be explained below, referring to the attached drawings.
FIGS. 1A to 1C show a first preferred embodiment of the manufacturing method according to the present invention. First, as shown in FIG. 1A, a first electrode layer 2 having a specific pattern is formed with an electroconductive material on a ceramic mother board 1, and then is covered with a first insulating layer 3. Next, a second electrode layer 4 is formed over the first electrode layer 2, and is covered with a second insulating layer 5. Furthermore, a third (uppermost) insulating layer 6 is formed on the second insulating layer 5. After that, the entire laminate is subjected to sintering.
The thickness is, for example, about 150 μm for the mother board 1, about 20 μm for the first insulating layer 3 plus the first electrode layer 2, about 20 μm for the second insulating layer 5 plus the second electrode layer 4, and from about 20 to about 30 μm for the third insulating layer 6.