Voltage generator stability indicator circuit
AssigneeMicron Technology, Inc.
InventorsBrent Keeth, Layne G. Bunker, Scott J. Derner
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AssigneeMicron Technology, Inc.
InventorsBrent Keeth, Layne G. Bunker, Scott J. Derner
Estimating the term…
A 256 Meg dynamic random access memory is comprised of a plurality of cells organized into individual arrays, with the arrays being organized into 32 Meg array blocks, which are organized into 64 Meg quadrants. Sense amplifiers are positioned between adjacent rows in the individual arrays while row decoders are positioned between adjacent columns in the individual arrays. In certain of the gap cells, multiplexers are provided to transfer signals from I/O lines to data lines. A datapath is provided which, in addition to the foregoing, includes array I/O blocks, responsive to the datalines from each quadrant to output data to a data read mux, data buffers, and data driver pads. The write data path includes a data in buffer and data write muxes for providing data to the array I/O blocks. A power bus is provided which minimizes routing of externally supplied voltages, completely rings each of the array blocks, and provides gridded power distribution within each of the array blocks. A plurality of voltage supplies provide the voltages needed in the array and in the peripheral circuits. The power supplies are organized to match their power output to the power demand and to maintain a desired ratio of power production capability and decoupling capacitance. A powerup sequence circuit is provided to control the powerup of the chip. Redundant rows and columns are provided as is the circuitry necessary to logically replace defective rows and columns with operational rows and columns. Circuitry is also provided on chip to support various types of test modes.
A stability sensor for a voltage generator generating an output voltage, comprising:
A stability sensor for a voltage generator of the type which utilizes a pullup and a pulldown current for regulation purposes, said sensor comprising:
Dependencies are inferred from the claim text.
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Arrangements for interconnecting storage elements electrically, e.g. by wiring: voltage and signal distribution in integrated semi-conductor…
Disposition of storage elements, e.g. in the form of a matrix array: geometric lay-out considerations of storage- and peripheral-blocks in a…
Power supply arrangements , e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels:…
Power supply arrangements , e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels: voltage…
Term ended 22 Aug 2017 (estimated)
1. Field of the Invention
The present invention is directed to integrated circuit memory design and, more particularly, to dynamic random access memory (DRAM) designs.
2. Description of the Background
For the present invention to be clearly understood and readily practiced, the present invention will be described in conjunction with the following figures wherein:
FIG. 1 illustrates the topology of one type of array architecture found in the prior art;
FIG. 2 is a block diagram illustrating a 256 Meg DRAM constructed according to the teachings of the present invention;
Reference is hereby made to an appendix which contains eleven microfiche having a total of sixty-six frames. The appendix contains 44 drawings which illustrate substantially the same information as is shown in FIGS. 1-113, but in a more connected format.
For convenience, this Description of the Preferred Embodiments is divided into the following sections:
I. Introduction