Memory module using DRAM package to match channel impedance
AssigneeIntel Corporation
InventorsMichael W. Leddige, James A. McCall
Life of this patent
Estimating the term…
Abstract
A memory module is described. That memory module includes a memory device and a signal trace that has an unloaded portion and a loaded portion. The loaded portion has a first section and a second section. The memory device includes an input connection and an output connection. The first section of the loaded portion of the signal trace is coupled to the input connection and the second section of the loaded portion of the signal trace is coupled to the output connection. The impedance of the loaded portion is higher than it would have been if the first and second sections had been coupled to the same memory device connection.
Claims15
A memory module comprising:
- a signal trace that includes an unloaded portion and a loaded portion, the loaded portion having a first section and a second section;
- and
- a memory device that includes an input connection and an output connection, the first section being coupled to the input connection and the second section being coupled to the output connection,
- wherein the impedance of the loaded portion is higher than it would have been if the first and second sections had been coupled to the same memory device connection.
A dynamic random access memory comprising:
- a die;
- a bond pad coupled to the die;
- a first connecting member that couples the bond pad to an input connection;
- a second connecting member that couples the bond pad to an output connection;
- an input connection for receiving a first section of a signal trace;
- and
- an output connection for receiving a second section of the signal trace.
A memory card comprising:
- a signal trace that includes an unloaded portion and a loaded portion, the loaded portion having a first section and a second section;
- and
- a dynamic random access memory, which is mounted to the memory card, that comprises:
- a die;
- a bond pad coupled to the die;
- a first connecting member that couples the bond pad to an input connection, which is coupled to the first section of the signal trace;
- and
- a second connecting member that couples the bond pad to an output connection, which is coupled to the second section of the signal trace.
Dependencies are inferred from the claim text.