Integrated circuit tester with high bandwidth probe assembly
AssigneeFormFactor, Inc.
InventorCharles A. Miller
Life of this patent
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Abstract
Described herein is a probe card assembly providing signal paths for conveying high frequency signals between bond pads of an integrated circuit (IC) and an IC tester. The frequency response of the probe card assembly is optimized by appropriately distributing, adjusting and impedance matching resistive, capacitive and inductive impedance values along the signal paths so that the interconnect system behaves as an appropriately tuned Butterworth or Chebyshev filter.
Claims19
A method for testing an integrated circuit having a surface including a node through which the integrated circuit communicates via a signal, the method comprising the steps of:
- a. contacting the node with a probe;
- b. linking a terminal of an integrated circuit tester to the probe through a conductive path, such that the node, the probe, the conductive path and the terminal form a signal path for conveying the signal between the integrated circuit and the integrated circuit tester,
- wherein the node, the probe, the terminal and the conductive path have impedances, and
- wherein impedances of at least one of the node, the probe, the terminal and the conductive path are sized relative to impedances of others of the node, the probe, the terminal and the conductive path to substantially optimize a frequency response characteristic of the signal path.
Dependencies are inferred from the claim text.