Prober and apparatus for semiconductor chip analysis

A prober for analyzing a semiconductor chip, comprising:

• a chip stage on which a semiconductor chip is mounted;
• a plurality of probes arranged to contact a surface of a semiconductor chip mounted on said chip stage;
• and
• a removable covering plate to cover said chip stage,
• wherein at least part of said chip stage in contact with a semiconductor chip is composed of a plate of infrared ray transmitting material, and
• wherein said plurality of probes are arranged and adapted to push a semiconductor chip onto said chip stage with pressure to fix the semiconductor chip on said chip stage.

A prober for analyzing a semiconductor chip, comprising:

• a plate of a material that is transparent to infrared rays and that is adapted to receive a semiconductor chip thereon;
• plural movable probes that are each adapted to contact a semiconductor chip on said plate, said plural probes being arranged and adapted to resist movement of the semiconductor chip away from said plate and to hold the semiconductor chip on said plate regardless of an orientation of said plate;
• and
• a projection affixed to said plate and that is arranged and adapted to resist lateral movement of the semiconductor chip across said plate.

A prober for analyzing a semiconductor chip, comprising:

• a plate of a material that is transparent to infrared rays and that is adapted to receive a semiconductor chip thereon;
• plural movable probes that are each adapted to contact a semiconductor chip on said plate, said plural probes being arranged and adapted to resist movement of the semiconductor chip away from said plate and to hold the semiconductor chip on said plate regardless of an orientation of said plate;
• a board having an opening in which said plate is mounted;
• and
• a cover that is removably attached to said board and that is spaced from said plate and covers said plural probes and a surface of said plate on which a semiconductor chip is received, said board and said cover each being arranged and adapted to be received on a wafer stage for analyzing a semiconductor chip.

A prober for analyzing a semiconductor chip, comprising:

• a base having an opening therein;
• a plate of a material that is transparent to infrared rays and that is mounted in said opening and adapted to receive a semiconductor chip thereon;
• a projection affixed to said plate and that is arranged and adapted to resist lateral movement of a semiconductor chip across said plate;
• plural movable probes that are each adapted to contact a semiconductor chip on said plate, said plural probes being arranged and adapted to resist movement of the semiconductor chip away from said plate and to hold the semiconductor chip on said plate regardless of an orientation of the prober;
• manipulators mounted on said board for moving said plural probes relative to a semiconductor chip on said plate;
• and
• a cover that is removably attached to said board and that is spaced from said plate and covers said plural probes and a surface of said plate on which a semiconductor chip is received,
• said base and said cover each being arranged and adapted to be received on a wafer stage for analyzing a semiconductor chip.