Image sensor semiconductor package with castellation

An image sensor semiconductor package comprising;

• a multi-layer substrate formed of a resin mask organic material;
• whereby a plurality of conductive traces are formed in the resin mask organic substrate forming a circuit pattern;
• a semiconductor chip adhesively bonded to the multi-layer resin mask organic substrate;
• whereby the semiconductor chip comprises a vision chip active area;
• a plurality of bonding wires respectively coupled to conductive portions of the semiconductor chip and the traces in the multi-layer resin mask organic substrate;
• a castellation formed on the multi-layer resin mask organic substrate;
• the castellation surrounding a perimeter of the semiconductor chip leaving the vision chip active area exposed;
• whereby the castellation is taller than the semiconductor chip and the plurality of bonding wires;
• a transparent window attached to a top side of the castellation and covering the semiconductor chip and the vision chip active area;
• and
• an encapsulant covering selected areas of the multi-layer resin mask organic substrate, the castellation, and the transparent window, the encapsulant overlapping a peripheral top portion of the transparent window and the castellation;
• the encapsulant and the castellation not touching or covering a part of the plurality of conductive members;
• and
• the castellation, encapsulant, and resin mask organic material comprise the same material;
• whereby the encapsulant protectively scals the image sensor semiconductor package.