Solder pad structure for low temperature co-fired ceramic package and method for making the same
AssigneeZeevo, Inc.
InventorsGuilian Gao, David John Lewis, Stephen Thomas Murphy
Life of this patent
Estimating the term…
Abstract
A package for semiconductor devices, and methods for making the same are provided. The package includes a low temperature co-fired ceramic body that has a plurality of conductive interconnect layers. The low temperature co-fired ceramic body includes at least one solder ball attach side. A plurality of solder ball attach pads are defined on the solder ball attach side(s) of the low temperature co-fired ceramic body. Each of the solder ball attach pads is in contact with a conductive via that is in electrical communication with at least one of the plurality of conductive interconnect layers, and each solder ball attach pad has metallic content that is limited to silver.
Claims33
A semiconductor ceramic package, comprising:
- a ceramic body defined by a plurality of conductive interconnect layers, the ceramic body including at least one solder ball attach side;
- a plurality of solder ball attach pads defined on the at least one solder ball attach side of the ceramic body, each of the solder ball attach pads being in contact with a conductive via that is in electrical communication with one of the plurality of conductive interconnect layers, each solder ball attach pad including metal content that is limited to silver metal;
- and
- a plurality of glass anchors, each glass anchor being configured to surround and overlap a periphery of each of the solder ball attach pads.
A package, comprising:
- a low temperature co-fired ceramic body including by a plurality of conductive interconnect layers, the low temperature co-fired ceramic body including at least one solder ball attach side,
- a plurality of solder ball attach pads defined on the at least one solder ball attach side of the low temperature co-fired ceramic body, each of the solder ball attach pads being in contact with a conductive via that is in electrical communication with at least one of the plurality of conductive interconnect layers, each solder ball attach pad having metallic content that is limited to silver.
A method for making a semiconductor package, comprising:
- providing a ceramic body including a plurality of metallic interconnect layers, the ceramic body having at least one solder ball attach side and a plurality of conductive vias;
- screen printing a solder ball attach pad over selected ones of the conductive vias, the solder ball attach pad being defined from metallic content that is limited to silver;
- and
- forming a glass anchor around an outer periphery of a number of the solder ball attach pads, the glass anchor overlapping at least a portion of the outer periphery and partially defined over the ceramic body, the glass anchor providing mechanical support to offset stress fractures at an interface between the solder ball attach pads and the ceramic body.
Dependencies are inferred from the claim text.