Interposer for improved handling of semiconductor wafers and method of use of same
AssigneeEaglestone Partners I, LLC
InventorJerry D. Kline
Life of this patent
Estimating the term…
Abstract
An apparatus (10) for reducing the likelihood of damaging a semiconductor wafer (18) and the integrated circuit chips of the semiconductor wafer (18) during handling is disclosed. The apparatus (10) comprises a wafer interposer (12) having a wafer receiving portion (28) and a handling portion (30). The wafer receiving portion (28) of the wafer interposer (12) has a plurality of contact pads (22) that are electrically connected and mechanically bonded to the contact pads of the integrated circuit chips of the wafer (18). The handling portion (30) of the wafer interposer (12) extends outwardly from the wafer receiving portion (28) such that the handling portion (30) is accessible to handling equipment without the handling equipment contacting the attached wafer (18).
Claims25
An apparatus for reducing the likelihood of damaging a wafer during handling, the wafer having a plurality of integrated circuit chips each having a plurality of contacts pads, the apparatus comprising:
- a wafer interposer having a wafer receiving portion and a handling portion, the wafer receiving portion having a plurality of contact pads for electrical and non-temporary mechanical connection to the contact pads of the integrated circuit chips of the wafer, the handling portion extending outwardly from the wafer receiving portion such that the handling portion is accessible without contacting the wafer receiving portion.
A wafer-interposer assembly comprising:
- a wafer having a plurality of integrated circuit chips each having a plurality of contact pads;
- and
- a wafer interposer having a wafer receiving portion and handling portion, the wafer receiving portion having a plurality of contact pads for electrical and non-temporary mechanical connection to the contact pads of the integrated circuit chips of the wafer, the handling portion extending outwardly from the wafer receiving portion such that the handling portion is accessible without contacting the wafer.
Dependencies are inferred from the claim text.