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US 6,686,650 B1Granted
Non-contact data carrier and IC chip
AssigneeDai Nippon Printing Co., Ltd.
InventorsMasao Gogami, Noboru Araki, Yasuko Hirata
Life of this patent
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Abstract
The non-contact data carrier has a resin substrate, a metallic antenna coil on the resin substrate, and an IC chip connected to the antenna coil via a plurality of bumps. Each bump of the IC chip has a base on the side of the IC chip body of the data carrier and a projection held by the base via a shoulder. Each bump is connected to the antenna coil by piercing the projection into the antenna coil.
Claims7
A non-contact data carrier comprising:
- a resin film substrate,
- a metallic antenna coil provided on said resin film substrate,
- an insulating adhesive provided on said metallic antenna coil, and
- an IC chip having an IC chip body, circuit wiring, and a plurality of bumps connected to said antenna coil, wherein
- (a) each bump of said IC chip has a projection connected to said antenna coil,
- (b) the projection has a triangular cross section that comes to a point, and
- (c) the projection pierces through said insulating adhesive and said antenna coil to reach said resin film substrate.
4 more elements
Dependencies are inferred from the claim text.