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US 6,686,648 B2Granted
Electronic component with stacked semiconductor chips and method of producing the component
AssigneeInfineon Technologies AG
InventorsUta Gebauer, Ingo Wennemuth
Life of this patent
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Abstract
The electronic component has semiconductor chips that are stacked on one another. On their active top sides, the chips having interconnects for rewiring to contact areas through contacts formed on the sawn edges of the semiconductor chip. The electronic components of overlying and underlying semiconductor chips are thus connected to one another via the through contacts.
Claims13
An electronic component, comprising:
- a stack of a plurality of semiconductor chips each having an active top side and a sawn edge;
- contact areas and interconnects formed on said active top side for rewiring to contact areas of respectively adjacent semiconductor chips;
- and
- said interconnects connecting to said contact areas on said active top side, extending toward said sawn edge of said semiconductor chip, and connecting to said respectively adjacent semiconductor chips via through-contacts formed at said sawn edge of said semiconductor chip.
1 more element
Dependencies are inferred from the claim text.