Method and system for exposed die molding for integrated circuit packaging
AssigneeSTMicroelectronics S.r.l.
InventorsTiao Zhou, Michael J. Hundt
Life of this patent
Estimating the term…
Abstract
A method for exposed die molding for integrated circuit packaging is provided that includes providing a mold comprising an upper mold with a flexible material, a lower mold, and a floating plunger. A substrate of an integrated circuit structure is clamped between the upper mold and the lower mold. An integrated circuit die of the integrated circuit structure is clamped between the floating plunger and the upper mold through the flexible material.
Claims20
A method for exposed die molding for integrated circuit packaging, comprising:
- providing a mold comprising an upper mold with a flexible material, a lower mold, and a floating plunger;
- clamping a substrate of an integrated circuit structure between the upper mold and the lower mold;
- and
- clamping an integrated circuit die of the integrated circuit structure between the floating plunger and the upper mold through the flexible material such that at least a portion of the flexible material lies between the integrated circuit die and the upper mold.
A method for exposed die molding for integrated circuit packaging, comprising:
- providing a mold comprising an upper mold, a lower mold, and a floating plunger;
- providing an integrated circuit die with a flexible material, the integrated circuit die coupled to a substrate;
- clamping the substrate between the upper mold and the lower mold;
- and
- clamping the integrated circuit die between the floating plunger and the upper mold through the flexible material such that at least a portion of the flexible material lies between the integrated circuit die and the upper mold.
A system for exposed die molding for integrated circuit packaging, comprising:
- an integrated circuit structure comprising an integrated circuit die and a substrate;
- a mold comprising an upper mold, a lower mold, and a floating plunger;
- a flexible material;
- the upper mold and the lower mold operable to lamp the substrate;
- and
- the floating plunger and the upper mold, through the flexible material, operable to clamp the integrated circuit die such that at least a portion of the flexible material lies between the integrated circuit die and the upper mold.
Dependencies are inferred from the claim text.