Method of manufacturing a semiconductor device a ball grid array package structure using a supporting frame

A method of manufacturing a semiconductor device, comprising the step of:

• bonding a plurality of semiconductor chips and a base member to a frame, said base member having a circuit wiring;
• electrically connecting said semiconductor chips and said base member having a circuit wiring;
• and
• resin-sealing said semiconductor chips using a mold, wherein in said step of resin-sealing, said plurality of semiconductor chips are positioned in place within said mold using said frame and are then resin-sealed.

A method of manufacturing a semiconductor device, comprising the steps of:

• bonding a semiconductor chip and a base member to a frame, said base member having a circuit wiring;
• electrically connecting a semiconductor chip and said base member having a circuit wiring;
• resin-sealing said semiconductor chip;
• and
• forming solder bumps on said resin-sealed semiconductor chip.

A method of manufacturing a semiconductor device, comprising the steps of:

• mounting a semiconductor chip on a base member having a circuit wiring;
• electrically connecting said semiconductor chip and said base member having a wiring;
• bonding said base member having a wiring to a frame;
• resin-sealing said semiconductor chip;
• and
• forming solder bumps on said resin-sealed semiconductor chip.

A method of manufacturing a semiconductor device, comprising the steps of:

• bonding a base member having a circuit wiring to a frame;
• mounting a semiconductor chip on said base member having a circuit wiring;
• electrically connecting said semiconductor chip and said base member having a circuit wiring;
• resin-sealing said semiconductor chip;
• and
• forming solder bumps on said resin-sealed semiconductor chip.