Method for fabricating multi-chip package semiconductor device
AssigneeOki Electric Industry Co., Ltd.
InventorYasufumi Uchida
Life of this patent
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Abstract
A semiconductor device includes a substrate (101); a first semiconductor chip (102) mounted on the substrate; and a first insulating layer (105) which is provided on the first semiconductor chip. The device further includes a metal layer (102) which is provided on the first insulating layer; a second insulating layer (117) which is provided on the metal layer; and a second semiconductor chip (104) which is provided on the second insulating layer.
Claims1
A method for fabricating a multi-chip package semiconductor device having a substrate, a first semiconductor chip mounted on the substrate, a first insulating layer which is provided on the first semiconductor chip, a metal layer which is provided on the first insulating layer, a second insulating layer which is provided on the metal layer, and second semiconductor chip which is provided on the second insulating layer, the method comprising the steps of:
- providing a semiconductor wafer in which a plurality of the second semiconductor chips are formed;
- providing a metal plate;
- providing insulating layers on the both surfaces of the metal plate;
- adhering the semiconductor wafer onto one surface of the metal plate with the insulating layer;
- and
- cutting the semiconductor wafer with the metal plate to obtain individual second semiconductor chips with the metal layers.
Dependencies are inferred from the claim text.