Stacked semiconductor device manufacturing method

A method of manufacturing a semiconductor device, comprising:

• mounting semiconductor elements on substrates each including first connection electrodes, first interconnections electrically connected to said first connection electrodes and an alignment mark with said semiconductor element electrically connected to said first interconnections,
• positioning and stacking said substrates having said semiconductor elements mounted thereon on core substrates based on recognition of said alignment marks, said core substrates each having second connection electrodes, second interconnections electrically connected to the second connection electrodes and a positioning pin hole for stacking, and having adhesive layers on both surfaces thereof;
• and
• performing thermo-compression bonding at temperatures of 120° C. or less at which an adhesive agent of said adhesive layers is melted, without being cured, to temporarily fix said substrates having said semiconductor elements mounted thereon on said core substrate by tackiness of said adhesive agent,
• mounting a plurality of core substrates on which said substrates having said semiconductor elements mounted thereon are temporarily fixed in a stacked form on a jig plate having a pin erected thereon by using said positioning pin holes, and
• bonding said plurality of core substrates by thermal pressing.

A method of manufacturing a semiconductor device comprising:

• mounting a semiconductor element on a substrate which has first connection electrodes, first interconnections electrically connected to said first connection electrodes and a first alignment mark, in a state where the semiconductor element is electrically connected to said first interconnections;
• transferring the substrate on which the semiconductor element is mounted, by attraction by means of a collet which has a heating tool incorporated therein;
• positioning and stacking a core substrate and the substrate on which the semiconductor element is mounted based on a recognition of the first alignment mark, said core substrate having second connection electrodes and second interconnections electrically connected to the second connection electrodes and having adhesive layers on both surfaces thereof;
• and
• performing a thermo-compression bonding at temperatures at which an adhesive agent of said adhesive layers is melted without being cured, by using the collet to temporarily fix the substrate on which the semiconductor element is mounted on said core substrate by tackiness of the adhesive agent.

A method of manufacturing a semiconductor device comprising:

• mounting semiconductor elements on substrates each including first connection electrodes, first interconnections electrically connected to said first connection electrodes and an alignment mark, in a state where the semiconductor elements are electrically connected to said first interconnections;
• transferring the substrates on which said semiconductor elements are mounted by attraction by means of a collet which has a heating tool incorporated therein;
• positioning and stacking the substrates on which the semiconductor elements are mounted on core substrates based on recognition of said alignment marks, said core substrates each having adhesive layers formed on both surfaces thereof and having second connection electrodes, second interconnections electrically connected to the second connection electrodes and a positioning pin hole for stacking;
• performing thermo-compression bonding at temperatures at which an adhesive agent of the adhesive layers is melted, without being cured, to temporarily fix the substrates on which the semiconductor elements are mounted on said core substrates by tackiness of the adhesive agent;
• mounting a plurality of core substrates on said substrates, wherein said substrates having said semiconductor elements mounted thereon, are temporarily fixed in a stacked form on a jig plate having a pin erected thereon by using said positioning pin holes;
• and
• bonding said plurality of core substrates by thermal pressing.