Method for forming packaged semiconductor device having stacked die
AssigneeIntegrated Device Technology, Inc.
InventorAnne T. Katz
Life of this patent
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Abstract
A method for forming a packaged semiconductor device and a packaged semiconductor device. A first semiconductor die is coupled to a package substrate. Wire bonds are then coupled to the first semiconductor die and to the package substrate. Encapsulant is applied such that the encapsulant extends over the first semiconductor die and over the wire bonds. The encapsulant is then at least partially cured. A second semiconductor die is coupled to the encapsulant. The second semiconductor die is electrically coupled to the ball grid array substrate. Encapsulant is then applied and cured to form a second layer of encapsulant that covers the second semiconductor die.
Claims12
A method for forming a packaged semiconductor device comprising:
- coupling a first semiconductor die to a package substrate;
- coupling a plurality of wire bonds to said first semiconductor die and to said package substrate so as to electrically couple said first semiconductor die to said package substrate;
- disposing encapsulant over said first semiconductor die and over said plurality of wire bonds;
- at least partially curing said encapsulant;
- coupling a second semiconductor die to said encapsulant, said second semiconductor die at least partially overlying said first semiconductor die;
- and
- electrically coupling said second semiconductor die to said package substrate.
A method for forming a packaged semiconductor device comprising:
- coupling a first semiconductor die to a ball grid array package substrate using adhesive;
- coupling a first set of wire bonds to said first semiconductor die and to said ball grid array package substrate such that said first semiconductor die is electrically coupled to said ball grid array substrate;
- forming a first layer of encapsulant that covers said first semiconductor die and said first set of wire bonds;
- coupling a second semiconductor die to said first layer of encapsulant using adhesive, said second semiconductor die at least partially overlying said first semiconductor die;
- coupling a second set of wire bonds to said second semiconductor die and to said ball grid array package substrate such that said second semiconductor die is electrically coupled to said ball grid array package substrate;
- and
- forming a second layer of encapsulant that covers said second semiconductor die and covers said second set of wire bonds.
Dependencies are inferred from the claim text.