Method of fabricating patterned layers of material upon a substrate

A method for fabricating upon the upper surface of a substrate a layer of a first material in a desired, design pattern comprising:

• depositing upon the substrate a layer of a first electrically conducting material;
• fabricating upon the substrate and the layer of first electrically conducting material a layer of a substantially insulating material having substantially the design pattern;
• adding by electroplating a layer of a second electrically conducting material on top of the portion of the layer of first electrically conducting material not covered by the layer of insulating material, the adding of the layer of the second electrically conducting material including the forming of a lip at the boundary of the second electrically conducting material, said lip overhanging the boundary of the insulating material, and wherein the second electrically conducting material may be the same as or differ from the first electrically conducting material;
• removing at least a portion of the layer of substantially insulating material from the substrate;
• fabricating upon the substrate and said layer of second electrically conducting material a layer of the first material in a manner such that the lip substantially inhibits the first material from covering substantially all of that portion of an edge of the second electrically conducting material that underlies the lip and the underside of the lip;
• removing at least a portion of the layer of second electrically conducting material and the overlying portion of the layer of the first material by chemical etching via that portion of the underlying edge of the second electrically conducting material and underside of the lip that is not substantially covered by the first material.

A method for fabricating upon the upper surface of a substrate a layer of a first material in a desired, design pattern comprising:

• fabricating upon the substrate a layer of photo-resist material substantially in the design pattern;
• fabricating upon the substrate a layer of a first electrically conducting material having an inverse pattern and including a lip at the boundary of the inverse pattern, which lip overlaps the layer of photo-resist at the boundary of the design pattern;
• adding by electroplating a layer of a second electrically conducting material on top of the layer of first electrically conducting material, wherein the second electrically conducting material may be the same as or differ from the first electrically conducting material;
• removing at least a portion of the layer of photo-resist material;
• fabricating upon the substrate and said layer of second electrically conducting material a layer of the first material in a manner such that the lip substantially inhibits the first material from covering substantially all of that portion of an edge of the second electrically conducting material that underlies the lip and the underside of the lip;
• removing at least a portion of the layer of second electrically conducting material and the overlying portion of the layer of the first material by chemical etching via that portion of the underlying edge of the second electrically conducting material and underside of the lip that is not substantially covered by the first material.