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US 6,686,106 B2Granted
Photosensitive resin compositions, insulating films, and processes for formation of the films
AssigneeUbe Industries, Ltd.
InventorsHiroshi Yasuno, Yoshiaki Watanabe, Hiroyuki Sakurai
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Abstract
An imide-based photosensitive resin composition comprised of (1) a photosensitive imidosiloxane oligomer comprised of a reaction product of an imidosiloxane oligomer having a functional group reactive with an epoxy group and an epoxy compound having a photosensitive group, (2) an isocyanate having an unsaturated bond, (3) a photopolymerization initiator, and (4) an organic solvent, an insulating film obtained by curing the same, and a process for production of such an insulating film.
Claims11
An insulating film, obtained by
- coating a photosensitive resin composition on a substrate;
- prebaking the resin composition to form a thin film;
- irradiating the resin composition patternwise with light;
- alkali developing the resin composition to remove the non-irradiated parts of the resin composition;
- and
- post-baking the resin composition to obtain a cured film,
- wherein the photosensitive resin composition comprises
- a photosensitive imidosiloxane oligomer;
- an isocyanate having an unsaturated bond;
- a photopolymerization initiator;
- and
- an organic solvent;
- wherein the amount of the photosensitive imidosiloxane oligomer used is 100 parts by weight, the amount of the isocyanate is 1 to 80 parts by weight, and the amount of the photopolymerization initiator is 0.01 to 30 parts by weight, and
- wherein the photosensitive imidosiloxane oligomer comprises a reaction product of an epoxy compound having a photosensitive group and an imidosiloxane oligomer having a functional group reactive with an epoxy group, wherein the imidosiloxane oligomer having a functional group reactive with an epoxy group is obtained by reacting 70 to 90 mol % of total diamines with 100 mol % of tetracarboxylic dianhydride, wherein the total diamines consist of 10 to 50 mol % of an aromatic diamine having a functional group reactive with an epoxy group, 10 to 70 mol % of a diaminopolysiloxane, and 0 to 20 mol % of an aromatic diamine having plural benzene rings.
11 more elements
A process for preparing an insulating film, comprising
- coating a photosensitive resin composition on a substrate;
- prebaking the resin composition to form a thin film;
- irradiating the resin composition patternwise to a ray of light;
- alkali developing the resin composition to remove the non-irradiated parts of the resin composition;
- and
- post-baking the resin composition to obtain a cured film,
- wherein the photosensitive resin composition comprises
- a photosensitive imidosiloxane oligomer;
- an isocyanate having an unsaturated bond;
- a photopolymerization initiator;
- and
- an organic solvent;
- ps wherein the amount of the photosensitive imidosiloxane oligomer used is 100 parts by weight, the amount of the isocyanate is 1 to 80 parts by weight, and the amount of the photopolymerization initiator is 0.01 to 30 parts by weight, and
- wherein the photosensitive imidosiloxane oligomer comprises a reaction product of an epoxy compound having a photosensitive group and an imidosiloxane oligomer having a functional group reactive with an epoxy group, wherein the imidosiloxane oligomer having a functional group reactive with an epoxy group is obtained by reacting 70 to 90 mol % of total diamines with 100 mol % of tetracarboxylic dianhydride, wherein the total diamines consist of 10 to 50 mol % of an aromatic diamine having a functional group reactive with an epoxy group, 10 to 70 mol % of a diaminopolysiloxane, and 0 to 20 mol % of an aromatic diamine having plural benzene rings.
11 more elements
Dependencies are inferred from the claim text.