Cooling plate and production method therefor

#1. Field of the Invention

#The present invention relates to a cooling plate used for, for example, various temperature controlling cooling plates such as backing plates, susceptors for use in sputtering apparatuses, semiconductor manufacturing apparatuses or LCD manufacturing apparatuses.

#In this specification, the language “aluminum” denotes aluminum and its alloys.

#FIG. 1 is a perspective view showing a cooling plate according to an embodiment of the present invention.

#FIG. 2 is a plan view of the cooling plate.

#FIG. 3A is a cross-sectional view taken along the line A—A in FIG. 1.

#A cooling plate according to an embodiment of the present invention is shown in FIGS. 1 to 3. This cooling plate 1 is a plate used as a backing plate for a sputtering apparatus, and is a clad plate comprised of two metal plates 2 and 3 stacked and integrally joined. In this embodiment, an aluminum plate is used as the metal plate 2 and 3.

#On each joining surface of the aforementioned two metal plates 2 and 3, a cooling medium passage forming groove 2a and 3a having a semicircular cross-sectional shape is formed. That is, as shown in FIG. 4, on the joining surface of the lower metal plate 3, a cooling medium passage forming groove 3a is formed such that one groove formed at one longitudinal end branches in the three directions, and these three grooves extends in parallel along the longitudinal direction and then these three grooves join at the other end. The upper metal plate 2 is also provided with exactly the same cooling medium passage forming groove 2a as that of the lower metal plate. As shown in FIG. 3A, the metal plates 2 and 3 are stacked and integrally joined in a manner that the grooves 2a and 3a coincide with each other, thereby forming a circuit-like coolant medium passage 4 in the cooling plate 1 (see FIG. 2).

#As enlarged and shown in FIG. 3B, on each of the joining surfaces of the two metal plates 2 and 3, an anodic oxide film 10 is formed. In detail, the cooling medium passage forming grooves 2a and 3a are covered with an anodic oxide film 10 and 10, respectively, and the remaining entire area of the joining surfaces of the metal plates 2 and 3 is also covered with an anodic oxide film 10 and 10. Since the anodic oxide film is formed on the cooling medium passage forming grooves 2a and 3a, the corrosion of the cooling medium passage 4 can be prevented effectively, and thus the durability as a cooling plate 1 can be effectively improved. Furthermore, since the anodic oxide film is formed on the entire joining surfaces of the metal plates 2 and 3 including the cooling medium passage forming grooves 2a and 3a, not only the corrosion prevention of the cooling medium passage 4 but also that of the entire joining surfaces can be attained, which further improves the durability of the cooling plate 1.