Transferable resilient element for packaging of a semiconductor chip and method therefor
AssigneeTessera, Inc.
InventorsKurt Raab, John W. Smith
Life of this patent
Estimating the term…
Abstract
A transferable resilient element assembly for fabricating a microelectronic package includes a first liner having a tacky material and a plurality of resilient elements, the plurality of resilient elements having a first surface being in contact with the the first liner. The plurality of resilient elements adhere to the tacky material so that upon removal of the plurality of resilient elements from the liner, the tacky material will adhere to the plurality of resilient elements and provide a tacky surface thereon.
Claims23
A transferable resilient element assembly for fabricating a microelectronic package comprising:
- a first liner including a tacky material;
- and
- a plurality of resilient elements, said plurality of resilient elements having a first surface being in contact with said first liner, said plurality of resilient elements adhering to said tacky material so that upon removal of said plurality of resilient elements from said liner said tacky material will adhere to said plurality of resilient elements and provide a tacky surface thereon.
A transferable resilient element assembly for fabricating a microelectronic package comprising:
- a first liner including a cure-inhibiting material;
- and
- a resilient element having regions with different degrees of cure being in contact with said first liner.
Dependencies are inferred from the claim text.